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Optical Microscopy used in conjunction with conventional metallurgical sectioning can often solve material or component problems quickly, efficiently and at a low cost. This technique permits measurement of plating thickness, solder and material grain structures and the distribution of intermetallic layers all of which are crucial to solder joint reliability. Our microscopes incorporate digital image capture allowing us to quickly report results.

Our Infra Red imaging camera can be used to investigate the thermal distribution of components, circuit boards or equipment A read out of temperature is available with a resolution of 0.1C and the temperature maps may be analysed and stored on a PC or recorded on video tape.

 

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Sales Tel 01279 635865 email sales@meadtest.com
Mead Testing Ltd 23/25 Mead Park, River Way, HARLOW, Essex CM20 2SE