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The Mead Testing microscopy and analysis laboratory is well equipped to assist with your failure analysis or materials characterisation needs. In addition to a high resolution scanning electron microscope and a suite of optical microscopes we have all the equipment required to prepare metallurgical sections and to locally remove the encapsulation from devices and integrated circuits. Our X Ray inspection facility may be used to conduct a non-destructive examination of the internal structure of devices to help determine the most appropriate decapsulation technique required to expose the internal components ready for optical or SEM imaging. Please click on a link below to find out more.

Scanning Electron Microscopy

Optical & Infrared Microscopy

 

Residues left on a silicon wafer after wet chemical etching viewed at X 10,000 magnification

Residues left on a silicon wafer after wet chemical etching viewed at X 10,000 magnification